ICS 77.060 CCS H 25 中国腐蚀与防护学会团体标准 T/CSCP 0059.2-2025 微机电系统（ MEMS）材料腐蚀芯片及传 感器 第2部分：选材与评价 Micro-Electro-Mechanical Systems (MEMS) material corrosion chip and sensor—— Part 2：Material selection and evaluation 2025-09-01发布 2025-10-01实施 中国腐蚀与防护学会 发 布 全国团体标准信息平台 T/CSCP 0059.2-2025 目 次 前言 …………………………………………………………………………………………………………… III 引言 ………………………………………………………………………………………………………… ...IV 1 范围 ................................ ................................ ................................ ................................ ................................ 6 2 规范性引用文件 ................................ ................................ ................................ ................................ ............ 6 3 术语和定义 ................................ ................................ ................................ ................................ .................... 7 4 选材原则 ................................ ................................ ................................ ................................ ........................ 7 4.1 功能性优先原则 ................................ ................................ ................................ ................................ ... 7 4.2 环境适应性原则 ................................ ................................ ................................ ................................ ... 8 4.3 全生命周期可靠性原则 ................................ ................................ ................................ ....................... 8 4.4 工艺可制造性原则 ................................ ................................ ................................ ............................... 8 4.5 经济性与可持续性原则 ................................ ................................ ................................ ....................... 8 5. 常用材料类型与性能要求 ................................ ................................ ................................ ............................. 9 5.1 敏感材料 ................................ ................................ ................................ ................................ .............. 9 5.2 结构材料 ................................ ................................ ................................ ................................ .............. 9 5.3 基板材料 ................................ ................................ ................................ ................................ ............ 10 5.4 介质层材料 ................................ ................................ ................................ ................................ ........ 10 5.5 互连材料 ................................ ................................ ................................ ................................ ............ 10 5.6 封装材料 ................................ ................................ ................................ ................................ ............ 10 5.7 芯片粘接材料 ................................ ................................ ................................ ................................ ..... 10 5.8 外壳材料 ................................ ................................ ................................ ................................ ............ 10 5.9密封材料 ................................ ................................ ................................ ................................ .............. 11 6. 评价方法 ................................ ................................ ................................ ................................ ........................ 11 6.1 通用要求 ................................ ................................ ................................ ................................ ............. 11 6.2 化学成分分析 ................................ ................................ ................................ ................................ ......11 全国团体标准信息平台 T/CSCP 0059.2-2025 6.3 力学性能评价 ........