JEDEC STANDARD Mechanical Compressive Static Stress Test Method JESD22-B119 OCTOBER 2018 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION JEDEC Downloadedbywangxue ([email protected])onJul12,2020,10:12pmPDT NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard to whether or not their adoptior may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address beloW, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2018 3103 North 10th Street Suite 240 South Arlington, VA 22201-2108 JEDEC retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved Downloaded bywang xue ([email protected]) on Jul 12, 2020, 10:12 pm PDT PLEASE! DON'T VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. Downloaded by wang xue ([email protected]) on Jul 12, 2020, 10:12 pm PDT HGG Downloaded by wang xue ([email protected]) on Jul 12, 2020, 10:12 pm PDT JEDEC Standard No. 22-B119 Page 1 MECHANICAL COMPRESSIVE STATIC STRESS TEST METHOD (From JEDEC Board Ballot, JCB-18-27, formulated under the cognizance of the JC-14.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope Devices of large size with high power consumption are fairly common. A heat sink may be used to dissipate heat from devices with high power consumption or those outputting a large amount of thermal energy. Such devices may endure high mechanical compressive stress from the heat sink resulting in failure; for example, issue like die crack could lead directly to electrical malfunction. As Figure 1, heat sink is used for the device of FC-BGA package with lid. Heat sink may be used for other packages, like package with stiffener, sometimes even for lidless or bare die. Heat-sink PCB PCBTray TIM2 TIM1 Device TIM1: Thermal interface material between die and lid for FC-BGA TIM2: Thermal interface material between devices and heat sink Figure 1 - IC device package and its heat sink on board Mechanical compressive strength is an inherent property of the device. Mechanical over stress and excessive localized loading may cause device failures. Permanent changes in electrical and/or physical characteristics c