IEC INTERNATIONAL STANDARD 62258-6 First edition 2006-08 Semiconductordieproducts Part 6: Requirementsforinformation concerning thermal simulation @ IEC 2006 — Copyright - all rights reserved No part of this publication may be reproduced or utilized in any form or by any means, electronic or Telephone: +41 22 919 02 11± Telefax: +41 22 919 03 00± E-mail: [email protected]: www.iec.ch J PRICECODE Commission Electrotechnique Internationale International Electrotechnical Commission MexAyHapoAHag nekTpoTexHMyeckan KoMMcCMg For price, see current catalogue CONTENTS INTRODUCTION. 1 Scope 2 Normative references 3 Terms and definitions.. .4 4 General 5 Requirementsfor informationforthermalsimulation. 5.1 Requirements for bare die with or without added connection structures. 5.2 Reguirementsforminimally-packageddie.. 5.3 Information on thermal simulation model .. .6 Annex ZA (normative) Normative references to international publications with their corresponding Europeanpublications.. Bibliography 8 -3- INTRODUCTION This standard is based on the work carried out in the_ESPRIT _4th Framework project GOODDIE which resulted in the publication of the ES 59008 series of European specifications.Organisations that helped prepare this part to IEC 62258 included the EsPRIT ENCAST project, theDie Products Consortium, JEITA, JEDEC and ZVEl. 4 SEMICONDUCTORDIEPRODUCTS- Part 6:Requirements for information concerning thermal simulation Scope This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products,including: wafers; singulated bare die; die and wafers with attached connection structures; This part of IEC 62258 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC62258-1andIEC62258-2. 2 Normative references The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies. For undated references, the latest edition IEC62258-1:Semiconductordieproducts-Part1:Requirementsforprocurement anduse IEC62258-2:Semiconductordieproducts-Part2:Exchangedataformats 3 Termsanddefinitions For the purposes of this document, the terms,definitions and acronyms as given in IEC 62258-1apply. 4 General To comply with IEC 62258-1, suppliers of die devices shall furnish information, which is necessary and sufficient for users of the devices at all stages of design, procurement, manufacture and test of products containing them.. It is expected that much of the information supplied will be in the public domain and available from such sources as manufacturers'data sheets. However, this standard does not place an disclosure agreement. - 5 - Requirements and recommendations provided in this standard apply to thermal simulation electrical performance of the die and system. 5 Reguirementsforinformationforthermalsimulation 5.1 Requirements forbare die with or without added connection structures 5.1.1 General This clause covers the requirements for bare die with or without added connection structures The following information shall be given as a minimum together with any information needed to satisfy a specific thermal simulation model. 5.1.2 Operatingtemperatureconditions Therangeof temperature underwhichthedeviceoperates shallbe stated 5.1.3 Maximum junctiontemperature Themaximumallowable junctiontemperatureshall bestated 5.1.4 Extended junctiontemperaturerange Further allowed junction temperatures exceeding the maximum junction temperatures with 5.1.5 Powerdissipation Maximum power dissipation values under specified conditions shall be stated. Minimum and typical powerdissipat