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BS 4584-103.2: BRITISH STANDARD 1990 IEC 249-3A: 1976 Metal-clad base materials for printed wiring boards Part 103: Special materials used in connection with printed circuits - Section 103.2 Specification for copper foil for use in the manufacture of copper-clad base materials BSi BS 4584-103.2:1990 Committees responsible for this British Standard BSI The preparation of this British Standard was entrusted by the Electronic Components Standards Policy Committee (ECL/-) to Technical Committee , Fri Dec 01 01:53:18 GMT+00:00 2006, Uncontrolled Copy, (c) E ECL/19 upon which the following bodies were represented: British Telecommunications plc ERA Technology Ltd. Electrical and Electronic Insulation Association (BEAMA Ltd.) Electronic Components Industry Federation Electronic Engineering Association GAMBICA (BEAMA Ltd.) Institute of Circuit Technology Institute of Metal Finishing Ministry of Defence National Supervising Inspectorate Printed Circuit Association Telecommunication Engineering and Manufacturing Association : sheffieldun sheffieldun, na, This British Standard, having been prepared under the Copy: direction of the Electronic Components Standards Policy Committee,was published under the authority of the Board of BSI and comes and Amendments issued since publication Licensed comes into effect on 28 February 1990 Date of issue Comments Amd. No. C BSI 04-1999 The following BSI references relate to this standard: Committee reference ECL/19 Draft for comment 89/23232 DC ISBN 0 580 18190 1 S4584-103.2:1990 BS Contents Page Committees responsible Inside front cover BSI National foreword ii , Fri Dec 01 01:53:18 GMT+00:00 2006, Uncontrolled Copy, (c) I Scope 1 Designation 2 1 Mass per unit area, and thickness 3 1 Chemical analysis 4 1 5 Electrical properties 1 Tensile properties (requirements for either lengthwise 6 or crosswire direction) 2 7 3 Surface finish 8 Solderability 3 9 Surface treatment 4 10 Roll dimensions and tolerances 4 Packaging 5 11 Appendix Sampling and methods of test 6 Table I 1 Table II 2 Table III 4 Table IV 6 Publication referred to Inside back cover Licensed Copy: shefieldun sheffieldun, na, CBSI 04-1999 1

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IEC 60249-3A 1976 First supplement Metal-clad base materials for printed circuits - Specification No. 2 Specification for copper foil for use in the manufacture of copper clad base materials 第 1 页 IEC 60249-3A 1976 First supplement Metal-clad base materials for printed circuits - Specification No. 2 Specification for copper foil for use in the manufacture of copper clad base materials 第 2 页 IEC 60249-3A 1976 First supplement Metal-clad base materials for printed circuits - Specification No. 2 Specification for copper foil for use in the manufacture of copper clad base materials 第 3 页
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