NORME CEI INTERNATIONALE IEC 249-2-13 INTERNATIONAL STANDARD 1987 AMENDEMENT1 AMENDMENT1 1993-05 Amendement 1 Materiauxdebasepour circuits imprimes Partie 2: Spécifications Spécification n°13: Filmflexible de polyimide recouvert de cuivre, de qualité courante Amendment 1 Base materials for printed circuits Part 2: Specifications Specification No. 13: Flexible copper-clad polyimide film, general purpose grade CEl 1993Droits de reproduction réservés - Copyright - all rights reserved Bureau Central de la Commission Electrotechnique Internationale 3, rue de Varembe Geneve, Suisse Commission Electrotechnique Internationale CODE PRIX C E( International Electrotechnical Commission PRICECODE MemayHapoAHan 3nekTporexHMyeCkas HoMucChg 2 - 249-2-13amend.1@CEl:1993 AVANT-PROPOS Leprésentamendementaétéétabli parlecomitéd'étudesn°52delaCEl:Circuits imprimes. Letextedecetamendementestissudesdocumentssuivants: DIS Rapports devote 52(BC)378 52(BC)387 52(BC)380 52(BC)389 52(BC)391 52(BC)395 Les rapports de vote indiqués dans le tableau ci-dessus donnent toute information sur le voteayant aboutia I'approbation de cet amendement. Page 8 4 Proprietesélectriques,tableau Ill Remplacerladésignationactuelledepropriétésparcequisuit: Résistancesuperficielleapreschaleurhumide,mesureeffectueedanslachambreclimatique(facultatif) Résistance superficielleapres chaleurhumideetreprise Resistivite transversale apres chaleur humide et reprise Copyright Intermational Electrotechnical Commissior istmgr, listmgr 249-2-13Amend.1IEC:1993 -3. FOREWORD This amendment has been preparedby iEC technical committee No.52: Printed circuits. Thetextofthisamendment is based onthefollowing documents: DIS Reports on Voting 52(CO)378 52(CO)387 52(CO)380 52(CO)389 52(CO)391 52(CO)395 Full information on the voting for the approval of this amendment can be found in the reportsonvotingindicatedintheabovetable Page 9 Electricalproperties,tableill 4 Replacethepresentpropertydesignationby: Surface resistance after dampheat while in the humidity chamber (optional) Surface resistance after damp heat and recovery Volume resistivity afterdamp heat while in the humidity chamber (optional) Volume resistivity after damp heat and recovery Copyright Intermational Electrotechnical Commission d without license from IHS