IEC IEC61191-3 Edition 2.0 2017-05 INTERNATIONAL STANDARD Printedboardassemblies- Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies IEC 61191-3:2017-05(en) International Electrotechnical Commissior THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright @ 2017 IEC, Geneva, Switzerland either IEC or IEC's memberNational Committee in the country of the requester.If you have anyquestions about IEC your local IEC member National Committee for further information. IEC Central Office Tel.: +4122 919 02 11 3, rue de Varembe Fax: +41 22 919 03 00 CH-1211 Geneva 20 [email protected] Switzerland www.iec.ch About theIEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. AboutIECpublications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latestedition, a corrigendaoranamendment might have been published. IEc Catalogue-webstore.iec.ch/catalogue Electropedia -www.electropedia.org The stand-alone application for theentire The world's leading online dictionary of electronic and consulting bibliographical information on IEc International Standards, electrical terms containing 20 000 terms and definitions in TechnicalSpecifications, Technical Reports andother English and French, with equivalent terms in 16 additional documents. Available for PC, Mac OS, Android Tablets and languages.Also known as the International Electrotechnical iPad. Vocabulary (IEV) online. IECpublicationssearch-www.iec.ch/searchpub IEC Glossary-std.iec.ch/glossary The advanced search enables to find IEC publications by a 65 000 electrotechnical terminology entries in English and varietyofcriteria (reference number, text, technical French extracted from the Terms and Definitions clause of committee,..). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and and withdrawn publications. CISPR. IEcJustPublished-webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published IECCustomerServiceCentre-webstore.iec.ch/csc details all new publications released.Available online and If you wish to give us your feedback on this publication or also once a month by email. need further assistance, please contact the Customer Service Centre: [email protected]. International Electrotechnical Commission IEC IEC61191-3 Edition 2.02017-05 INTERNATIONAL STANDARD Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.240 ISBN 978-2-8322-4397-8 Warning! Make sure that you obtained this publication from an authorized distributor. nark of the International Electrotechnical Commission